Topic: Applied plasma technology in electronics fabrication - pretreatment in electronics production, circuit board cleaning, antistatic cleaning, wafer cleaning
Electronics Fabrication: Openair® plasma for pretreatment in electronics production
High demands on purity and freedom from electric charges
Openair® plasma technology in the electronics industry is an innovative process for handling components and circuits during production and/or fabrication. In doing this not only are high requirements for cleanliness met but the treatment is also carried out completely free of electric potential, i.e. during plasma treatment the circuits are not exposed to electric voltage. By using Openair® plasma sensitive components such as silicon wafers, LCD displays or integrated circuits (ICs) can be pretreated very effectively during the wire bonding process.
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| Pretreatment for bonding engine control housings |
Antistatic cleaning of printed circuit boards prior to encapsulation |
Openair® plasma is used in-line
The plasma jets and other components can be integrated with ease into already existing production lines. A separate chamber is not needed. Any problems caused by atmospheric oxygen are effectively prevented by treatment under an atmosphere of inert gas.
On request we will be happy to send you information about other applications and research reports on this topic. In addition to your regional representative, our key account manager, Peter Langhof, based in our Plasmatreat Germany South office is available for further information.
