Topic:
Glossary: B
Here you are going to find explications of important terms in plasma technology:
- barrel reactor
- Cylindrical plasma reactor characterized by an axial flow of the process gas. Widely used during the early development of plasma processing, less often used today.
- BGA
- Ball Grid Array is a casing box form for integrated circuits where the leads for SMD assembly lie compactly on the rear side of the chip. The leads are little balls of solder that stand side by side in an array, consisting of columns and rows. These balls are melted open when soldered in the soldering furnace, and unite with the copper of the printed circuit board.
- bias voltage
- The DC component at the electrode. Its value depends on the size of the electrode and on the pressure of the process gas.
- binding energy
- The binding energy is, generally spoken, the energy that is released when two particles build a new complex. In order to separate the two particles again, the same amount of energy is necessary
- bonding
- The term “bonding” in electrical engineering means a connection method using very thin wires. In semiconductor technics it means a nondetachable junction of two bodies, in most cases. Bonding contains connections like e.g. silicon fusion bonding, eutectic bonding, adhesive bonding, anodic bonding, glass frit bonding, soldering, etc. Two different kinds of bonding are to be distinguished: die bonding and wire bonding.
