Topic:
Glossary: M
Here you are going to find explications of important terms in plasma technology:
- magnetron sputtering
- A magnetron sputter source has magnets to force the electrons out of the plasma and into spiral paths. This raises the plasma density and therewith the coating rate at lower burning voltage (typically 500V in comparison to 1500V). Because of the lower voltage, the material is not strained as much. The arrangement of the magnets causes ring-shaped sputter trenches (race-track rings) on the target. The distance to the electrode is essential for the ignition of the plasma (dark-space distance): about 3 mm for DC, 5 mm for HF applications.
- making a Teflon surface hydrophilic
- see „etching Teflon“
- mask
- Covering in lithography and coating processes.
- mean free path
- Activated components (ions, electrons, dissociated fragments) have a certain life-span, depending on the ambient conditions (solid body, liquid, gas). The life-span can be expressed by a flight distance. That is called mean free path. An energy input, supplied by impact or direct energy injection, is seen as the cause for the components‘ movement. The free path is thus to be seen as a description of the energy state that can be given in eV or as well in K. A plasma can thus be characterised by the mean free path of electrons and ions, as much as through the indication of the neutral gas temperature.
- medical, biological, and biotechnological instruments
- Medical and biological instruments can be cleaned and disinfected by a plasma.
- metal
- Certain chemical elements solidify in a way that free electrons (electron gas) are present in the material. For this reason, metals show high electrical and heat conductivity. Metals are normally weldable and form with oxygen durable surface coatings.
- MHz plasma system
- Through activation in the range of some MHz, a gas can be heated up so much that it turns into the plasma state.
- Micro Electro Mechanical Systems (MEMS)
-
Through lithography and thin film systems / thin film technology, micro
electro mechanical systems (MEMS) provide the possibility to produce
two- and three-dimensional objects and structures in the order of
magnitude of a few micrometers only. Micro electro mechanical systems
combine the methods of micro electronics, micro mechanics, micro
fluidics, and micro optics, but also developments of computer sciences,
biotechnology, and nanotechnology, by recombining developments and
structures of all these areas into new systems.
Well-known example are optical sensors in wireless mouses, or modern printers’ bubble-jet print heads combining micrometer-fine jets with heating elements, partly even with their own intelligence in the print head.
Further examples of application are acceleration sensors for the triggering of airbags, revolution rate sensors for roll-over bars, AFM (atomic force microscope) cantilevers, instruments of keyhole surgery like endoscope systems, or chemical sensors for food monitoring. - Micro Opto Electro Mechanical Systems (MOEMS)
- see “Micro Electro Mechanical Systems (MEMS)”
- micro sandblasting
- For surfaces coatings not affectable by plasma, mechanical blasting processes with grit sizes of less than 200 nm are applicable. In some cases, a surface treatment with highly accelerated (high bias voltage) atoms of inert gases is referred to as micro sandblasting, since inert gases can not react with (etch) the surface.
- micro-keying
- see „precision cleaning“
- Micromachines
- see “Micro Electro Mechanical Systems (MEMS)”
- micro-sandblasting
- see „precision cleaning“
- microwave plasma
- The activation of particles through microwaves of about 2.45 GHz can heat up a gas so much that it turns into the plasma state.
- microwave technology
- Plasmas can easily be stabilised by high-frequency electrical injection. The simplest method is the injection of frequencies in the range of radio- or microwaves, via ductors and wave guides. Under atmospheric pressure conditions (constant pressure conditions), this yields isothermal plasmas.
- modification of a Teflon surface
- see „etching Teflon"


