Silicon wafers, chips, and high-performance semiconductors are highly sensitive electronic components. As these technologies have developed, so has low-pressure plasma technology as a manufacturing process.
The enhancement of the Openair® Plasma process under atmospheric pressure opens up entirely new possibilities, in particular for automation. A vacuum is no longer required for plasma treatment, so process flows can be greatly simplified.
International ALUMINIUM Journal (7-8/2017)
HIGHLIGHT (SH1/Technik 2017)
IST (International Surface Technology 1/2017)