Topic: Plasma-activation high-performance semiconductors. Super-fine wafer cleaning. Chip bonding. Gluing chips. Manufacturing semiconductors.

Non-vacuum processing – Openair® plasma unleashes new potential for the manufacture of semiconductors

Silicon wafers, chips, and high-performance semiconductors are highly sensitive electronic components. As these technologies have developed, so has low-pressure plasma technology as a manufacturing process.
The enhancement of the Openair® Plasma process under atmospheric pressure opens up entirely new possibilities, in particular for automation. A vacuum is no longer required for plasma treatment, so process flows can be greatly simplified.

More advantages of Openair® Plasma systems:

  • Super-fine cleaning (component cleaning) without damaging sensitive structures;
  • Targeted functionalization of surfaces for selective additional processing;
  • Lean process layout, noticeable cost savings; and
  • Lower error rates in bonding processes.

Plasmatreat UK Ltd.
D5 Culham Science Centre,
Abingdon, Oxfordshire
OX14 3DB
Great Britain

Phone: +44 1865 408324

Contact: Mr. Graham Porcas
grahamporcas@btconnect.com

 
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Plasmatreat Open House
Grand opening of Plasmatreat's new subsidiary and customer application center

30. – 31. March 2017
Hayward, CA, United States

INDUSTRIE LYON
The Tradeshow for Production Technologies

4. – 7. April 2017
stand W67 hall 6
EUROEXPO LYON
Lyon, France

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