Topic: Desmearing. Atmospheric plasma super-fine cleaning of drilled holes in circuit boards. Abrasive plasma.
Abrasive Plasma – Alternative Procedure to Clean Drilled Holes (Desmearing) in Printed Circuit Boards
cleaning is an important step in printed circuit board processing
prior to through-hole plating. Until now, this step was performed
mainly in elaborate chemical or low-pressure plasma procedures that
required interrupting the manufacturing process with separate chamber
systems. In contrast, desmearing using the inline Openair® process
is done in atmospheric conditions, which simplifies and accelerates
the relevant process and reduces costs as well.
Drilled hole cleaned inline
in conjunction with the use of industrial
gases, the Openair® process can form a strongly abrasive plasma that
provides outstanding selectivity and high removal rates. The first
installations of this new plasma technology are now in the
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