Topic: Desmearing. Atmospheric plasma super-fine cleaning of drilled holes in circuit boards. Abrasive plasma.

Abrasive Plasma – Alternative Procedure to Clean Drilled Holes (Desmearing) in Printed Circuit Boards

Drilled hole cleaning is an important step in printed circuit board processing prior to through-hole plating. Until now, this step was performed mainly in elaborate chemical or low-pressure plasma procedures that required interrupting the manufacturing process with separate chamber systems. In contrast, desmearing using the inline Openair® process is done in atmospheric conditions, which simplifies and accelerates the relevant process and reduces costs as well.
BohrlochreinigungDrilled hole cleaned inline
Especially in conjunction with the use of industrial gases, the Openair® process can form a strongly abrasive plasma that provides outstanding selectivity and high removal rates. The first installations of this new plasma technology are now in the preparatory stages.

back to main topic Printed circuit boards

Plasmatreat (UK) Ltd.
36 Grange Park
Steeple Aston
Bicester
OXON OX25 4SR
Great Britain

Phone: +44 1869 340478

Contact: Mr. Graham Porcas
grahamporcas@btconnect.com

 
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