Topic: Gluing chips to circuit boards, improved adhesion in the flow process. Lead-free flow soldering.

Gluing Chips to Circuit Boards

Components are soldered to circuit boards in a cost-effective procedure called a wave soldering process. Up-to-date processes to accomplish this are typically lead-free. Wave soldering involves a higher temperature soldering bath, however, which in turn places greater demands on the adhesion of those components to the printed circuit board.
Kleben Chips LeiterplattenPlasma surface activation for improved adhesive performance
Surface activation of the components’ surfaces and the chips using Openair® plasma has shown a significant improvement in the performance of the adhesive used to fix the components in place for further processing in the solder bath.

back to main topic Wafers/Chips

Plasmatreat UK Ltd.
D5 Culham Science Centre,
Abingdon, Oxfordshire
OX14 3DB
Great Britain

Phone: +44 1865 408324

Contact: Mr. Graham Porcas
grahamporcas@btconnect.com

 
Plasma beam cleans and activates covering and sealing surfaces
"Give Leaks No Chance" - Plasma-pre-treatment protects electronics
Secure protection for electronic components
Glasstec 2016
Glasstec 2016
International Trade Fair for Glass Processing, Production and Products

20. – 23. September 2016
Hall 11, Booth G46
Düsseldorf, Germany

Micronora 2016
International microtechnology and precision trade fair

27. – 30. September 2016
Micropolis / Parc des Expositions
Besancon Cedex, France

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