Topic: Gluing chips to circuit boards, improved adhesion in the flow process. Lead-free flow soldering.

Gluing Chips to Circuit Boards

Components are soldered to circuit boards in a cost-effective procedure called a wave soldering process. Up-to-date processes to accomplish this are typically lead-free. Wave soldering involves a higher temperature soldering bath, however, which in turn places greater demands on the adhesion of those components to the printed circuit board.
Kleben Chips LeiterplattenPlasma surface activation for improved adhesive performance
Surface activation of the components’ surfaces and the chips using Openair® plasma has shown a significant improvement in the performance of the adhesive used to fix the components in place for further processing in the solder bath.

back to main topic Wafers/Chips

Plasmatreat (UK) Ltd.
36 Grange Park
Steeple Aston
Bicester
OXON OX25 4SR
Great Britain

Phone: +44 1869 340478

Contact: Mr. Graham Porcas
grahamporcas@btconnect.com

 
Plasma beam cleans and activates covering and sealing surfaces
"Give Leaks No Chance" - Plasma-pre-treatment protects electronics
Secure protection for electronic components
parts2clean
Leading International Trade Fair for Industrial Parts and Surface Cleaning

31. May – 2. June 2016
Hall 5, Booth E19
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31. May – 10. June 2016
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Düsseldorf Fairgrounds , Germany

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