Topic: Plasma treatment of silicon wafers. Nano-plasma cleaning, super-fine cleaning of wafers.
Nano-Plasma Cleaning of Silicon Wafers
manufacturing begins with a block of semiconductor material. This is
sliced (sawed) into wafers, which are then polished in a
chemical/mechanical process until the required surface roughness of a
few nanometers is achieved.
Polished and plasma treated wafer
the next step, Openair®
plasma is used as a highly efficient and simple procedure for
super-fine cleaning of these nano-structures. One hundred percent of
carbohydrates and particles are removed and error rates can be
significantly reduced using this Openair® Plasma cleaning.
back to main topic Wafers/Chips