Nano-Plasma Cleaning of Silicon Wafers

Wafer manufacturing begins with a block of semiconductor material. This is sliced (sawed) into wafers, which are then polished in a chemical/mechanical process until the required surface roughness of a few nanometers is achieved.

Polished and plasma treated wafer

In the next step, Openair® plasma is used as a highly efficient and simple procedure for super-fine cleaning of these nano-structures. One hundred percent of carbohydrates and particles are removed and error rates can be significantly reduced using this Openair® Plasma cleaning.

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