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Activation before applying solder mask


Peter Langhof
17.06.2014

Especially at high circuit boards there is the risk of the paint to be very thin at their edges. More precisely, the coating thickness at the edge radius is very low especially at reduced ...


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Desmearing drilled holes with Openair® plasma


Peter Langhof
04.11.2013

The manufacture of printed circuit boards is as diverse as the product itself and the requirements that the product is now required to satisfy. We are currently experiencing an exponential rise in ...


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Long-term corrosion protection for electronic components


Peter Langhof
05.09.2013

Electronic components must be protected from corrosion wherever they come into contact with moisture. Reliable long-term protection from moisture ingress is a basic requirement when bonding or ...


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Applying conductive traces to plastic housings with the new FPC® process


Peter Langhof
05.09.2013

The FPC (fine powder coating) process pre-cleans and activates components in a single, environmentally-friendly operation, then selectively deposits metallic coatings in a matter of ...


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