Drilled hole cleaning is an important step in printed circuit board processing prior to through-hole plating. Until now, this step was performed mainly in elaborate chemical or low-pressure plasma procedures that required interrupting the manufacturing process with separate chamber systems. In contrast, desmearing using the inline Openair® process is done in atmospheric conditions, which simplifies and accelerates the relevant process and reduces costs as well.
Especially in conjunction with the use of industrial gases, the Openair® process can form a strongly abrasive plasma that provides outstanding selectivity and high removal rates. The first installations of this new plasma technology are now in the preparatory stages.