Improve Electronics Manufacturing Yield with Openair-Plasma®
In electronics manufacturing, surface treatment is essential for ensuring strong adhesion between dissimilar materials, enhancing coating wettability, and maintaining long-term reliability. Plasmatreat’s Openair-Plasma® technology delivers precise, selective, and inline-capable plasma surface treatment under atmospheric pressure—without the use of vacuum chambers or chemical primers.
Variety of Applications
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Discover how our Openair-Plasma® technology can enhance your processes. From the initial concept to successful implementation, we offer personalized, innovative, and sustainable support every step of the way.
The introduction of Openair-Plasma® was a milestone in the development of our sensor production.
Benefits of Openair-Plasma® technology
- Selective: switch on and off on the fly
- Super-fine cleaning (component cleaning) without damaging sensitive structures
- Targeted functionalization of surfaces for selective additional processing
- Environmentally friendly: no wet chemicals required
- Cost-effective: operates with oil-free compressed air
- In-line capability: no effect on process time because the plasma process takes less time than the conformal coating process
Openair-Plasma® process
Openair-Plasma® is used to modify surface characteristics so as to enhance the adhesion of materials (such as coatings) to the substrate (PCB). It removes all organic and silicone-based impurities. Oxygen in the form of hydroxyl and ketone groups are incorporated into non-polar surfaces to activate the surface. The result is high surface energy (over 72mN/m) and in most cases, complete wettability.
