Flexible printed circuit boards are now indispensible, especially in today’s mobile electronics. And flexible printed circuit boards are more and more frequently constructed of multiple layers due to the constantly increasing circuit component density. Firm adhesion is critical for trouble-free functioning of multiple-layer structures.
The adhesion between the individual layers is significantly improved with Openair® Plasma activation. Since this often involves large-scale applications, systems with RD1010 plasma jets are used. The leading Japanese manufacturer of printed circuit board manufacturing equipment, Hitachi, offers this jet technology in its systems.