AURORA 250, 450 and 1000: Low-Pressure Plasma Systems for Cleaning, Activation and Etching
Components with complex geometries, difficult-to-access areas or demanding surface requirements often need more than selective treatment from the outside. A controlled process environment allows the complete component, several parts or suitable bulk materials to be treated within one chamber cycle. AURORA 250, 450 and 1000 are low-pressure plasma systems for full-surface treatment in a vacuum chamber. Depending on the application, they clean, activate or etch component surfaces in preparation for bonding, coating, printing, potting or overmoulding.
Three chamber sizes, configurable plasma excitation and a choice of door and workpiece-handling concepts allow the system to be adapted to process development, batch production or automated production integration. AURORA 250, 450 and 1000 establish the configurable platform principles used across the AURORA-Plasma portfolio. Plasma excitation, gas supply, control, handling and process configuration are selected according to the application. Process knowledge developed on one AURORA system can support transfer to another system concept.
Three chamber sizes, one platform
AURORA 250, 450 or 1000 follow the same configurable system concept while providing different chamber sizes. The appropriate system depends on the component dimensions, chamber loading, required handling and intended production environment. The chamber sizes support controlled plasma treatment within the available process volume, with the achievable treatment uniformity depending on component geometry, loading, workpiece handling, plasma excitation and the selected process recipe. For this reason, treatment uniformity is validated for each specific application.
Depending on the application, different workpiece handling options can be used. A rotary table rotates fixtured components during treatment and can support more uniform plasma exposure depending on the component geometry and loading concept. For suitable bulk materials, a rotary drum keeps the parts in motion throughout the process. Whether drum treatment is appropriate is evaluated based on factors such as part geometry, mechanical sensitivity and loading quantity.
The door concept can be adapted to the component handling and production layout. A swing door provides direct manual access to the chamber, while a pull-out door can facilitate loading with trays or fixtures. For integration into automated production environments, an in-line door enables the chamber to become part of an automated material flow.
| AURORA 250 | AURORA 450 | AURORA 1000 | |
|---|---|---|---|
| Chamber, W × D × H | 250 × 250 × 250 mm | 400 × 490 × 433 mm | 1000 × 1000 × 1000 mm |
| Application focus | Smaller components, process development and lower production volumes | Medium components or several parts within one cycle | Larger components or several parts within one cycle |
| Workpiece handling | Rotary table or rotary drum | Rotary table or rotary drum | Rotary table or rotary drum |
| Door concepts | Swing door, pull-out door or in-line door at the front or side | Swing door, pull-out door or in-line door at the front or side | Swing door, pull-out door or in-line door at the front or side |
Configurable plasma excitation
A 2.45 GHz microwave generator with a power range of 100 to 1,000 W provides the primary plasma excitation. Depending on the application, optional 13.56 MHz and 40 kHz excitation can extend the available process range. The excitation sources can be operated individually or in approved combinations, depending on the system configuration. The selected frequency influences plasma density, ion interaction and how energy is transferred to the process. However, frequency alone does not determine the surface result. Process gas, pressure, power, treatment time, component geometry and loading must be considered together.
The appropriate excitation or frequency combination is defined during process development according to the target criterion, material, geometry, process gas and operating conditions.
| Excitation | Process characteristic | Application consideration |
|---|---|---|
| 2.45 GHz microwave | Supports high plasma density and low ion energy | Often evaluated for cleaning, activation and components requiring low thermal load |
| 13.56 MHz RF | Provides an additional way to control the plasma-surface interaction | Evaluated where the process requires a different balance of plasma density and ion interaction |
| 40 kHz | Supports stronger ion interaction with the surface | May be relevant for controlled material removal and other ion-supported processes |
Cleaning, activation, etching and oxide reduction on AURORA 250, 450 and 1000
Which surface objective is reached is not determined by the chamber size. It results from the recipe: process gas, plasma excitation, treatment time and the way the components are loaded. All three chamber sizes offer the same process options, so process knowledge gained on one system provides the starting point for another when volumes or component sizes change.
Process gases and process control
The gas supply is configured according to the required plasma process. Two mass flow controller channels are included as standard. Up to two additional gas inlets are available as an option. Gas flow, pressure, plasma power and treatment time form part of the process recipe. The selected process gas influences how the plasma interacts with the surface, but no individual gas determines the result on its own. Gas composition, pressure, excitation, power, treatment time, material and initial surface condition are evaluated together during process development. The appropriate gas or gas mixture is selected and validated against the target criterion using representative sample parts.
| Process gas | Typical process objective | Application-specific effect |
|---|---|---|
| Oxygen, O2 | Cleaning and activation | Can support oxidation of organic residues and modification of polymer surfaces |
| Argon, Ar | Physical plasma interaction and process support | Chemically inert process gas that may be used independently or as part of an application-specific gas concept |
| Nitrogen, N2 | Activation and surface modification | Can support nitrogen-related surface modification depending on the material and process |
| Hydrogen, H2 | Reduction and cleaning | Can support the reduction of suitable metal oxides under validated process conditions |
| Forming gas | Reduction-oriented processes | Can provide a controlled hydrogen-containing process atmosphere |
| Air or O2/N2 mixtures | Cleaning and activation | Can provide an application-specific balance of oxidative and nitrogen-containing plasma chemistry |
Process control with the Plasmatreat PCU
A stable plasma process requires more than a stored recipe. Process control, monitoring, validation and production integration need to work together. The Plasmatreat Plasma Control Unit, PCU, supports the process-control concept for the AURORA system. The PCU provides a dedicated basis for integrating relevant process information into the overall control and quality-assurance approach.
The specific PCU configuration is selected according to the plasma process, validation requirements and production environment. During process development, Plasmatreat identifies which process parameters are relevant to the required surface result. The validated process window then provides the basis for recipe management, process monitoring and production documentation. Recorded system parameters can document whether a cycle was completed within its defined process settings. Application-specific surface measurements verify whether the required treatment result has been achieved. An industrial PLC with touchscreen panel controls the system. Recipe storage and multi-level user and access management protect validated parameter sets against unintended changes.
Process data acquisition and system interfaces support integration into the production and quality-assurance environment. Ethernet and USB interfaces and VPN remote maintenance are included. Interfaces to production systems are defined according to the integration concept. The PCU, system control and application-specific verification methods form complementary parts of the process-control strategy. Plasmatreat’s corporate governance positions process control, measurable results, validation and quality assurance as core parts of the customer solution, not as isolated hardware features.
Integration: manual, automated or in-line
AURORA 250, 450 and 1000 processes components in defined chamber cycles consisting of loading, evacuation, treatment and venting. Different door, control and handling concepts enable manual operation or integration into automated production.
In manual mode, the operator loads the chamber, selects the validated recipe and starts the cycle, while automatic operation begins after receiving the required release signal. Depending on the configuration, automatic door opening, soft start and soft venting can support the production and handling concept. With an in-line door at the front or side, the chamber can be connected to automated loading by conveyor or robot. The appropriate solution depends on the component, loading method, cycle sequence, available space, surrounding equipment, system interfaces, process control and quality-assurance requirements. Plasmatreat considers production integration an integral part of the complete process solution, working with customers to align material flow, component handling, interfaces and quality assurance with the validated plasma process.
Where standard configurations do not meet specific chamber access, handling or interface requirements, Plasmatreat evaluates an application-specific system configuration together with the customer, acting as a technology, process, development, validation and integration partner.
Functional coating with AURORA systems
Some applications require more than cleaning, activation or etching. If a specifically defined surface function is needed, PlasmaPlus® functional plasma coating provides a different solution pathway. AURORA 250, 450 or 1000 can be configured to provide the low-pressure process environment required for selected PlasmaPlus® coating processes. The required coating equipment, process configuration and system concept are selected according to the application and desired surface function.
PlasmaPlus® is Plasmatreat’s technology for functional plasma coating. It is not an upgrade to cleaning or activation. Cleaning and activation work with the existing properties of a surface, while PlasmaPlus® adds specifically defined surface functions through a coating process.
Three ways to validate the process
FAQ
What is the difference between AURORA 250, AURORA 450 and AURORA 1000?
The main difference is the chamber size.
AURORA 250 has a chamber measuring 250 × 250 × 250 mm. AURORA 450 provides a chamber measuring 400 × 490 × 433 mm and AURORA 1000 has a chamber measuring 1000× 1000× 1000 mm
The systems follow the same configurable platform concept, with options for plasma excitation, gas supply, doors and component handling. The appropriate system depends on component dimensions, loading and production requirements.
Do I need 13.56 MHz or 40 kHz excitation?
The appropriate excitation depends on the required surface effect, material, component geometry, process gas and loading.
The 2.45 GHz microwave source provides the primary plasma excitation. Optional 13.56 MHz or 40 kHz excitation may be evaluated where the application requires a different plasma-surface interaction or controlled material removal.
The appropriate configuration is determined during process development.
How long does one process cycle take?
Evacuation takes between 15 and 60 seconds depending on the configuration and chamber load. Treatment starts from 10 seconds.
The complete cycle also includes loading, venting and unloading. The actual cycle time depends on the material, loading concept, system configuration and target criterion and is determined during process development.
Can AURORA systems be integrated into an automated line?
Yes. In-line doors at the front or side and automatic operation allow the chamber to operate as a station within an automated production environment.
Loading can be connected to conveyor or robot handling. Plasmatreat evaluates the material flow, component handling, interfaces, cycle sequence and process-control requirements with the customer.
How is the treatment result verified?
The appropriate verification method depends on the target criterion.
Wettability can be assessed with test inks or contact-angle measurement. Adhesion is evaluated with a test method that reflects the relevant downstream process and quality requirements.
Recorded system parameters document the completed process cycle. Application-specific measurements verify the resulting surface condition.
What is the role of the Plasmatreat PCU?
The Plasmatreat Plasma Control Unit, PCU, supports the process-control concept for the AURORA system.
Its configuration is selected according to the plasma process, validation requirements, quality-assurance concept and production environment.
Can AURORA 250, AURORA 450 or AURORA 1000 apply functional coatings?
AURORA 250, 450 and 1000 can be configured for selected PlasmaPlus® coating processes.
Functional coating requires the appropriate coating equipment and an application-specific system and process configuration. The required surface function and coating process are considered when the system concept is defined.
Is AURORA 250 or AURORA 450 suitable for wafers?
For wafer processing and front-end semiconductor processes, AURORA Semi provides the dedicated system concept.
Which system should I consider for larger components?
If the component or required loading exceeds the available AURORA 1000 chamber dimensions, AURORA Large Chamber should be evaluated.